Batch micromachining uses silicon wafers to remove material until it reaches its final shape, while surface micromachining builds up a part layer by layer. Mass micromachining typically uses wet chemical etching, but dry etching using a plasma or laser system is becoming more popular. Silicon is the most common material used, and wet etching is cheaper but less accurate than dry etching.
Batch micromachining is a method of making extremely small mechanical or electrical components. This process typically uses silicon wafers, but occasionally uses plastic or ceramic material as well. Batch micromachining starts with a solid part and removes material until it reaches its final shape, as opposed to surface micromachining, which builds up a part layer by layer. The most common method of mass micromachining is via selective masking and wet chemical solvents. The newer alternative to this method is dry etching using a plasma or laser system to remove unwanted material. This is generally more accurate than wet etching, but is also more expensive.
Micromachining is the process of making really small parts. These components could be anything from a diode to a toothed gear the size of a pen tip. There are two main ways to go about this process. Surface micromachining will use the individual layers of a silicon wafer to create a part on top of an existing layer. While this is a very important process, it is more difficult to make completely independent and unique pieces.
To make these types of components, manufacturers will use mass micromachining. In many ways, this is similar to carving a marble statue, only on a much smaller scale. A silicon wafer is machined to remove any unwanted parts in the final piece. Batch processing will go from large to small while the surface method will go from small to large.
The vast majority of batch micromachining uses silicon. The material is extremely cheap as it makes up nearly a quarter of the earth’s crust. Additionally, it possesses a very fine crystalline structure that it can break down into thinner layers than a human hair. This allows the material to work on a microscopic as well as a macroscopic level.
The most common method of mass micromachining is called wet chemical etching. First, the work piece is covered with a material that will protect it from a selected solvent. The protective mask is then selectively removed to expose areas of the part that are peeling off. The work piece is exposed to a solvent, which will then dissolve any unprotected areas and leave the rest intact. Subsequently, the remaining masking material is removed.
The newer method for bulk micromachining is called dry etching. This uses a high-precision device, often a laser, to vaporize unwanted material. Compared to the wet process, these are several fewer steps and the total absence of potentially dangerous solvents. The main reason this process is no longer popular is its relative newness compared to the wet method and the expense of purchasing the equipment.
Protect your devices with Threat Protection by NordVPN
