Semiconductors are used in modern technology and fall between conductors and insulators. They can be made from various materials, with silicon being the most popular due to its low cost and simple processing. The manufacturing process involves cutting, etching, applying layers, and doping. The final step is coating with conductive metal and testing.
Semiconductors are an ever-present element in modern technology. When judged by their ability to conduct electricity, these devices fall between complete conductors and insulators. They are used as part of a digital circuit in computers, radios, telephones and other equipment.
The semiconductor manufacturing process begins with the base material. Semiconductors can be made from a dozen such materials including germanium, gallium arsenide, and several indium compounds such as indium antimonide and indium phosphide. The most popular base material is silicon due to its low production cost, simple processing, and temperature range.
Using silicon as an example, the semiconductor manufacturing process begins with the production of silicon wafers. First, the silicon is cut into round wafers using a diamond tipped saw. These wafers are then sorted by thickness and checked for damage. One side of the wafer is then etched with a chemical and highly polished to remove all impurities and damage. Chips are built on the smooth side.
A layer of silicon dioxide glass is applied to the shiny side of the silicon wafer. This layer does not conduct electricity, but it does help prepare the material for photolithography. The manufacturing process also applies layers of circuit patterns to the wafer after it has been coated with a layer of photoresist, a light-sensitive chemical. The light is then beamed through a grating and lens mask so that the desired circuit pattern is printed onto the wafer.
The photoresist pattern is washed off using a number of organic solvents mixed together in a process called incineration. The process results in a three-dimensional (3D) wafer. The wafer is then washed using wet and acidic chemicals to remove any contaminants and residue. More layers can be added by repeating the entire photolithography process.
Once the layers are added, areas of the silicon wafer are exposed to chemicals to make them less conductive. This is done by using dopant atoms to displace silicon atoms in the original wafer structure. It is difficult to control how many doping atoms are implanted in any one area.
The final task in the semiconductor manufacturing process is the coating of the entire wafer surface with a thin layer of conductive metal. Copper is usually used. The metal layer is then polished to remove unwanted chemicals. Once the semiconductor manufacturing process is finished, the finished semiconductors are tested thoroughly.
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