Sputtering targets are used in sputter deposition to create thin films, commonly in semiconductor and computer chip production. Targets can be metallic or ceramic and come in various shapes and sizes, including segmented and rotating targets. The effectiveness depends on composition and ion type used. Argon is commonly used, but other noble gases may be […]
Sputtering is a physical vapor deposition process where a solid target material is ejected onto a substrate to form a thin coating. A sputtering system contains the entire process and allows for adjustments in temperature, power, pressure, target, and substrate materials. The system uses an energy source to generate electrons that bombard a gas plasma, […]
