Wafer-level packaging is a technique in which packaging is applied around each circuit board before the wafer is separated into individual circuits. This method streamlines the manufacturing process, reduces production time and cost, and allows for smaller component sizes. Components manufactured with wafer-level packaging are widely used in consumer electronics and other applications. Wafer-level packaging […]
Wafer bonding is the process of fusing mechanical or electrical devices to a small wafer of semiconductive material, resulting in a finished chip. The process requires a clean substrate surface, precise temperature, and exact pressure. Different bonding techniques include direct bonding, plasma activated bonding, and thermocompression bonding. Testing methods are used to ensure the finished […]
Wafer seals are self-adhesive paper disks used to seal envelopes or prepare self-shipped materials for delivery. They were derived from sealing wax seals and were used for document protection. Today, they are sold in rolls and used for sealing bulky brochures or providing decorative seals for envelopes. They come in various styles and colors and […]
