Sputtering targets are used in sputter deposition to create thin films, commonly in semiconductor and computer chip production. Targets can be metallic or ceramic and come in various shapes and sizes, including segmented and rotating targets. The effectiveness depends on composition and ion type used. Argon is commonly used, but other noble gases may be more effective for lighter or heavier molecules.
A sputtering target is a material that is used to create thin films in a technique known as sputter deposition or thin film deposition. During this process the sputtering target material, which starts out as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, known as a substrate. Sputter deposition is commonly involved in making semiconductors and computer chips. As a result, most sputtering target materials are metallic elements or alloys, although there are some ceramic targets available that create hardened thin coatings for various instruments.
Depending on the nature of the thin film being created, sputtering targets can be very large in size and shape. The smallest targets can be less than 2.5cm in diameter, while the largest rectangular targets reach over a meter (0.9m) in length. Some sputtering equipment requires a larger sputtering target and in these cases manufacturers will create segmented targets connected by special joints.
The designs of sputtering systems, the machines that conduct the thin film deposition process, have become much more varied and specific. As a result, the shape and structure of the dartboard also began to broaden in variety. The shape of a sputtering target is usually rectangular or circular, but many target suppliers can create additional special shapes upon request. Some sputtering systems require a rotating target to provide a more accurate and uniform film. These targets are shaped like long cylinders and offer added benefits including faster deposition rates, less heat damage, and increased surface area, leading to greater overall utility.
The effectiveness of sputtering target materials depends on several factors, including their composition and the type of ions used to break them down. Thin films that require pure metals for the target material usually have higher structural integrity if the target is as pure as possible. The ions used to bombard the sputtering target are also important for producing a decent quality thin film. Generally, argon is the primary gas of choice to ionize and initiate the sputtering process, but for targets that have lighter or heavier molecules a different noble gas is more effective, such as neon for lighter molecules or krypton for the heavier molecules. It is important that the atomic weight of the gas ions be similar to that of the sputtering target molecules to optimize the transfer of energy and momentum, thus optimizing the uniformity of the thin film.
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