DC magnetron sputtering is a method of physical vapor deposition used to create thin films by bombarding a substance with ionized gas molecules in a vacuum chamber. Magnetrons are used to control the path of displaced atoms, allowing for predictable film deposition rates and thicknesses. Sputtering has a wide variety of industrial uses, including creating coatings for optical lenses, CDs and DVDs, and high-efficiency insulated windows.
DC magnetron sputtering is one of several types of sputtering, which is a method of physical vapor deposition of thin films of one material onto another material. The most common sputtering deposition methods in use as of 2011 are ion beam sputtering, diode sputtering, and DC magnetron sputtering. Sputtering has a wide variety of scientific and industrial uses and is one of the fastest growing manufacturing processes used in modern manufacturing.
Quite simply, sputtering occurs in a vacuum chamber, where a substance is bombarded with ionized gas molecules that displace atoms from the substance. These atoms fly off and hit a target material, called a substrate, and bond with it at the atomic level, creating a very thin film. This sputter deposition is done at the atomic level, so the film and substrate have a virtually indestructible bond, and the process produces a uniform, extremely thin and cost-effective film.
Magnetrons are used in the sputtering process to help control the path of displaced atoms as they fly randomly around the vacuum chamber. The chamber is filled with a low-pressure gas, often argon, and several high-voltage magnetron cathodes are positioned behind the coating material target. The high voltage flows from the magnetrons through the gas and creates high energy plasma which strikes the target of the coating material. The force generated by these plasma ion strikes causes the atoms to be ejected from the coating material and bond to the substrate.
The atoms that are ejected in the sputtering process usually fly through the chamber in random patterns. Magnetrons produce high-energy magnetic fields that can be positioned and manipulated to collect and contain the plasma generated around the substrate. This forces the ejected atoms to travel predictable paths to the substrate. By controlling the path of the atoms, it is also possible to predict and control the film deposition rate and thickness.
The use of DC magnetron sputtering allows engineers and scientists to calculate the times and processes required to produce specific qualities of film. This is called process control and allows this technology to be used by industry in mass production operations. For example, sputtering is used to create coatings for optical lenses used in items such as binoculars, telescopes, and infrared and night vision equipment. The computer industry uses CDs and DVDs that have been produced using sputtering processes, and the semiconductor industry uses sputtering to coat many types of chips and wafers.
Modern high-efficiency insulated windows use sputter-coated glass, and many hardware, toys, and decorative items are manufactured using this process. Other industries that use sputtering include aerospace, defense and automotive industries, medical, energy, lighting and glass industries, and many others. Despite its already widespread use, industry continues to find new uses for DC magnetron sputtering.
Protect your devices with Threat Protection by NordVPN
