Thermal epoxy is an adhesive resin with added substances to improve heat transfer. They can be conductive or non-conductive and are used in various applications such as heat sinks in computers. It is important to use the minimum amount necessary and follow manufacturer instructions.
Thermal epoxy is any adhesive epoxy resin to which one or more substances are added to improve heat transfer. These epoxies can be electrically conductive or non-conductive, depending on the thermal additive used. Silver and other metal-based thermal additives are generally electrically conductive, and thermal epoxies containing these additives must be applied very carefully to avoid causing an electrical short. Ceramic-based additives are not electrically conductive but are not as efficient at thermal conduction.
Manufacturers produce thermal epoxies designed to function as high-performance engineering adhesives and structural adhesives in a wide variety of applications and environments. These include planes, boats, marine equipment, automobiles, surfboards, snowboards, and bicycles, among others. There are thermal formulations for nearly every application imaginable, including those that cure underwater, those that remain very flexible or become quite stiff once cured, those that are resistant to fire or high heat, and even those certified by the U.S. National Aeronautics and Space Administration. United States. (NASA) for low outgassing.
Heat can damage or destroy electrical components, and today’s high-speed computer components produce a large amount of heat that must be removed. Devices called heat sinks are used to draw heat away from an object and dissipate the heat into the air, sometimes with the help of a cooling fan. Heat sinks are made from metal alloys designed to have excellent thermal conduction properties and have specially designed fins to help conduct and remove heat. They are almost always mounted to a surface using a special epoxy thermal adhesive.
When used in computer applications, a thermal epoxy can help fill microscopic voids that occur in the surfaces of heat sinks and other devices. These voids occur in the manufacturing process. When two objects are fitted together, such as a chip and a heat sink, the voids fill with air. Air is a poor thermal conductor, so a substance is introduced to fill the voids and help conduct the heat to the heat sink for removal. The substance used can be thermal grease, thermal tape, thermal pads or, if the device is to be fixed to the mounting surface, thermal epoxy.
When applying thermal epoxy it is very important to use the minimum amount necessary to fill any voids and build a bond. If too thick a layer of epoxy is applied, the electrical conductivity of the epoxy will be degraded. Once the epoxy has cured, the bond between the two surfaces is permanent. Epoxies should only be used in well ventilated areas and the manufacturer’s instructions should always be followed for best results.
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