Wire bonding is a process used to connect electronic components using gold, aluminum, or copper due to their conductivity and bonding temperatures. It involves low heat, ultrasonic energy, and pressure traces to avoid damaging the circuit board. Ball and wedge bonding techniques are used, with up to 10 bonds created per second. The process varies depending on the metal used, with ball bonding using a needle-like device to hold the thread in place and wedge bonding using a tool to create pressure. It is not recommended for amateurs to attempt wire bonding without proper instruction. The process can be automated for more precise connections.
At first blush, “wire bonding” might seem like just another term for soldering, but in reality, the process is a little more complex because there are additional variables involved. The wire bonding process is performed on electronic devices in order to connect various components together permanently, but due to the delicacy of the project, only gold, aluminum and copper are normally applied, due to their conductivity and relative bonding temperatures. This method is completed using a ball or wedge bonding technique that combines low heat, ultrasonic energy, and pressure traces to avoid damaging the electronic circuit board. The microchip or corresponding pad can be damaged easily using improper execution, so it is highly recommended that you practice on a previously damaged or disposable chip before attempting wire bonding.
Wire bonding is mainly used in almost all types of semiconductors due to its cost efficiency and ease of application. In optimal environments, up to 10 bonds can be created per second. This method varies slightly with each type of metal used due to their respective elemental properties. The two types of wire ties typically used are the ball tie and the wedge tie.
While the best choice for a ball link is pure gold, copper has become a popular alternative due to its relative expense and availability. This process requires a needle-like device, not much different than what a seamstress would use, to hold the thread in place while extremely high tension is applied. The tension along the surface causes the molten metal to form into a spherical shape, hence the name of the process. When copper is used for ball bonding, nitrogen is used in gaseous form to prevent the formation of copper oxide during the wire bonding procedure.
Wedge bonding uses a tool to create pressure on the wire as it is applied to the microchip. After the wire is held securely in place, ultrasonic energy is applied to the surface and a solid bond is created in multiple areas. Wedge bonding takes nearly twice as long as a similar ball bond would, but is also considered to be a much more stable bond and can also be completed with aluminum or several other alloys and metals.
It is not advisable for an amateur to attempt ball bonding or wedge bonding without first receiving proper instruction, due to the sensitive nature of wire bonding and the risk involved in damaging electrical circuits. The technology that has been developed has made it possible to fully automate both of these processes and bonding of cables is rarely completed by hand. The end result is a much more precise connection that tends to last longer than those created with traditional manual cable bonding methods.
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